MI325X GPU

The AMD MI325X is a server-focused compute accelerator built on AMD's CDNA 3 architecture, manufactured using TSMC's 5nm/6nm FinFET process technology. Positioned as AMD's response to high-end data center AI workloads, the MI325X features 256 GB of HBM3E memory and delivers 1.3 PFLOPs of FP16 performance. The GPU comes in an OAM (Open Accelerator Module) form factor with passive cooling design, targeting enterprise deployments where thermal management and rack density are critical considerations. Key technical specifications include 1,216 compute units, 6 TB/s of memory bandwidth delivered through an 8,192-bit memory interface, and support for multiple precision formats including FP64, FP32, FP16, and FP8. The MI325X achieves 2.61 PFLOPs of FP8 performance, extending to 5.22 PFLOPs when utilizing structured sparsity optimizations. Interconnect capabilities include PCIe 5.0 x16 and AMD's Infinity Fabric with 8 links operating at 128 GB/s, enabling multi-GPU scaling in distributed computing environments. In cloud deployments, the MI325X targets large-scale AI training workloads, high-performance computing applications, and inference tasks requiring substantial memory capacity. The 256 GB HBM3E memory configuration makes it suitable for processing large language models and datasets that exceed the memory limits of consumer-oriented GPUs, while the 1000W power envelope requires appropriate data center infrastructure and cooling solutions.