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MI300X GPU

First introduced in 2024, the AMD MI300X merges CPU and GPU functionalities under a unified memory system, streamlining AI and HPC workloads. AMD emphasizes its enhanced efficiency for large-scale training tasks, while also highlighting the platform’s versatility across diverse workloads.

VRAM 192GB
TDP 750W
Process 5nm
From
$1.71/hr
across 6 providers
MI300X GPU

Cloud Pricing

Cheapest on TensorWave 21% below avg
ProviderGPUsPrice / hrUpdatedSource
1× GPU
$1.71
4/4/2026
1× GPU
$1.85
4/2/2026
1× GPU
$1.99
4/5/2026
2× GPU
$1.99
4/5/2026
4× GPU
$1.99
4/1/2026
8× GPU
$1.99
4/5/2026
1× GPU
$1.99
4/7/2026
8× GPU
$1.99
4/7/2026
1× GPU
6mo$2.00
3/30/2026
1× GPU
3mo$2.12
3/30/2026
1× GPU
1mo$2.23
3/30/2026
1× GPU
$2.71
4/7/2026
1× GPU
$3.45
4/5/2026
Direct from providerVia marketplace

Prices updated daily. Last check: 4/7/2026

Performance

FP16
1305 TFLOPS
FP32
163.4 TFLOPS
BF16
1307.4 TFLOPS
FP8
2614.9 TFLOPS
INT8
2610 TOPS
Bandwidth
5300 GB/s

Strengths & Limitations

  • 192 GB HBM3 memory capacity enables large model training and inference
  • 5.3 TB/s peak memory bandwidth supports memory-intensive workloads
  • 2,610 TOPS INT8 performance with structured sparsity acceleration
  • Eight Infinity Fabric Links provide 1,024 GB/s total interconnect bandwidth
  • CDNA 3 architecture optimized for AI and HPC compute patterns
  • PCIe 5.0 x16 interface offers high-speed host connectivity
  • AMD ROCm ecosystem provides open-source software stack
  • 750W TDP requires substantial power and cooling infrastructure
  • OAM form factor limits deployment to compatible server platforms
  • AMD GPU ecosystem has narrower software support compared to NVIDIA CUDA
  • High memory capacity may be excessive for smaller AI models
  • Released in 2023, making it a previous-generation design

Key Features

AMD CDNA 3 Architecture
Structured Sparsity Support
HBM3 Memory Technology
AMD Infinity Architecture
Infinity Fabric Links
AMD ROCm Software Platform
FP8 Precision Support
OAM Module Form Factor

About MI300X

The AMD MI300X is a high-end data center accelerator built on AMD's CDNA 3 architecture, manufactured using TSMC's 5nm/6nm FinFET process. As AMD's top-tier GPU accelerator released in 2023, it competes in the ultra-performance segment for demanding AI and HPC workloads. The MI300X features an OAM module form factor and integrates with AMD's ROCm ecosystem and Infinity Architecture for scalable deployments. The MI300X delivers substantial compute capabilities with 192 GB of HBM3 memory and 5.3 TB/s peak memory bandwidth. Its CDNA 3 architecture provides 1,305 TFLOPS of FP16 performance, 163.4 TFLOPS of FP32 performance, and 2,610 TOPS of INT8 performance. The accelerator supports structured sparsity to boost performance further, reaching up to 2.61 PFLOPs of FP8 performance and 1.3 PFLOPs of TF32 performance. Connectivity includes PCIe 5.0 x16 and eight Infinity Fabric Links with 128 GB/s peak bandwidth each. In cloud deployments, the MI300X targets large-scale generative AI training and inference workloads that require substantial memory capacity and bandwidth. Its 192 GB memory configuration enables handling of large language models and complex HPC simulations that would exceed the memory limits of smaller accelerators.

Common Use Cases

The MI300X suits large-scale generative AI training and inference tasks that require substantial memory capacity, particularly for large language models and multimodal AI applications. Its 192 GB memory configuration accommodates models that exceed the capacity of smaller accelerators, while the 5.3 TB/s memory bandwidth supports memory-bound workloads. The accelerator also targets high-performance computing applications including scientific simulations, computational fluid dynamics, and molecular modeling that benefit from high FP32 and FP64 performance combined with large memory capacity.

Full Specifications

Hardware

Manufacturer
AMD
Architecture
CDNA 3
Compute Units
304
Process Node
5nm
TDP
750W

Memory & Performance

VRAM
192GB
Memory Bandwidth
5300 GB/s
FP32
163.4 TFLOPS
FP16
1305 TFLOPS
BF16
1307.4 TFLOPS
FP8
2614.9 TFLOPS
FP64
81.7 TFLOPS
INT8
2610 TOPS
Release
2023

Frequently Asked Questions

How much does a MI300X cost per hour in the cloud?

MI300X pricing varies by provider, region, and commitment level. Check the pricing table above for current rates across all providers.

What is the MI300X best used for?

The MI300X excels at large-scale AI training and inference workloads that require substantial memory capacity, particularly large language models and generative AI applications. Its 192 GB memory and high bandwidth also make it suitable for memory-intensive HPC simulations and scientific computing tasks.

How does MI300X compare to NVIDIA H100 for AI workloads?

The MI300X provides 192 GB memory compared to H100's 80 GB, enabling larger model deployment. Both offer similar FP16 performance levels, but they use different software ecosystems - MI300X uses AMD ROCm while H100 uses CUDA. The choice often depends on software compatibility requirements and memory capacity needs.